发明授权
- 专利标题: Semiconductor device, integrated circuit and method of manufacturing a semiconductor device
- 专利标题(中): 半导体器件,集成电路及制造半导体器件的方法
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申请号: US14027570申请日: 2013-09-16
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公开(公告)号: US09123801B2公开(公告)日: 2015-09-01
- 发明人: Andreas Meiser , Till Schloesser , Thorsten Meyer
- 申请人: Infineon Technologies AG
- 申请人地址: DE Neubiberg
- 专利权人: Infineon Technologies AG
- 当前专利权人: Infineon Technologies AG
- 当前专利权人地址: DE Neubiberg
- 代理机构: Murphy, Bilak & Homiller, PLLC
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L29/78
摘要:
A semiconductor device includes a transistor in a semiconductor substrate having a first main surface. The transistor includes a source region, a drain region, a channel region, a drift zone, and a gate electrode adjacent to at least two sides of the channel region. The channel region and the drift zone are disposed along a first direction parallel to the first main surface, between the source region and the drain region. The semiconductor device further includes a conductive layer beneath the gate electrode and insulated from the gate electrode.
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