发明授权
- 专利标题: Memory cells and memory cell arrays
- 专利标题(中): 存储单元和存储单元阵列
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申请号: US14448352申请日: 2014-07-31
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公开(公告)号: US09123888B2公开(公告)日: 2015-09-01
- 发明人: Scott E. Sills , Gurtej S. Sandhu , Sanh D. Tang , John Smythe
- 申请人: Micron Technology, Inc.
- 申请人地址: US ID Boise
- 专利权人: Micron Technology, Inc.
- 当前专利权人: Micron Technology, Inc.
- 当前专利权人地址: US ID Boise
- 代理机构: Wells St. John P.S.
- 主分类号: H01L45/00
- IPC分类号: H01L45/00 ; H01L27/24
摘要:
Some embodiments include memory cells. The memory cells may have a first electrode, and a trench-shaped programmable material structure over the first electrode. The trench-shape defines an opening. The programmable material may be configured to reversibly retain a conductive bridge. The memory cell may have an ion source material directly against the programmable material, and may have a second electrode within the opening defined by the trench-shaped programmable material. Some embodiments include arrays of memory cells. The arrays may have first electrically conductive lines, and trench-shaped programmable material structures over the first lines. The trench-shaped structures may define openings within them. Ion source material may be directly against the programmable material, and second electrically conductive lines may be over the ion source material and within the openings defined by the trench-shaped structures.
公开/授权文献
- US20140339494A1 Memory Cells and Memory Cell Arrays 公开/授权日:2014-11-20
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