Invention Grant
- Patent Title: Impedance matching apparatus
- Patent Title (中): 阻抗匹配装置
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Application No.: US14238065Application Date: 2012-08-03
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Publication No.: US09124241B2Publication Date: 2015-09-01
- Inventor: Sang Hun Lee
- Applicant: Sang Hun Lee
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2011-0078626 20110808
- International Application: PCT/KR2012/006202 WO 20120803
- International Announcement: WO2013/022237 WO 20130214
- Main IPC: H03H7/38
- IPC: H03H7/38 ; H03H7/40 ; H04B1/04 ; H04B1/18

Abstract:
Disclosed is an impedance matching apparatus performing impedance matching between a front-end module and an antenna. The impedance matching apparatus includes an RF front end providing a multi-band RF signal, a reflected power measuring module measuring a reflection coefficient for the RF input signal, a matching unit adjusting impedance so that the reflection coefficient is minimized, a first switch module provided in the RF front end to selectively switch the RF signal onto a bypass path, and a controller allowing the RF signal to be switched onto the bypass path if a specific frequency range is detected from the reflection coefficient.
Public/Granted literature
- US20140167878A1 IMPEDANCE MATCHING APPARATUS Public/Granted day:2014-06-19
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