Invention Grant
- Patent Title: Systems and methods for header compression
- Patent Title (中): 头压缩的系统和方法
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Application No.: US13656249Application Date: 2012-10-19
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Publication No.: US09125087B2Publication Date: 2015-09-01
- Inventor: George Cherian , Santosh Paul Abraham , Simone Merlin
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent James K. O'Hare
- Main IPC: H04W4/00
- IPC: H04W4/00 ; H04W28/06

Abstract:
Systems, methods, and devices for communicating packets having a plurality of types are described herein. In some aspects, the packets include a compressed header. In one embodiment, a compression protocol is selected from a plurality of compression protocols to compress a first packet header. The packet may contain a second packet header, which may include information indicative of the compression protocol used to compress the first packet header. The packet may be transmitted, including the first packet header which is compressed using the selected compression protocol.
Public/Granted literature
- US20130100886A1 SYSTEMS AND METHODS FOR HEADER COMPRESSION Public/Granted day:2013-04-25
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