Invention Grant
- Patent Title: Solder and lead free electronic circuit and method of manufacturing same
- Patent Title (中): 焊接和无铅电子电路及其制造方法
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Application No.: US14548805Application Date: 2014-11-20
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Publication No.: US09125313B2Publication Date: 2015-09-01
- Inventor: Carmen Rapisarda
- Applicant: Carmen Rapisarda
- Agency: Wagner, Anderson + Bright PC
- Agent Roy L. Anderson
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K1/11 ; H05K1/18 ; H05K3/32 ; H01R12/70 ; H05K1/02 ; H05K3/28

Abstract:
An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that is in contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.
Public/Granted literature
- US20150077940A1 Solder and Lead Free Electronic Circuit and Method of Manufacturing Same Public/Granted day:2015-03-19
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