Invention Grant
- Patent Title: Heat-expandable microspheres and a method of making heat-expandable microspheres and application thereof
- Patent Title (中): 热膨胀性微球和制造热膨胀性微球的方法及其应用
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Application No.: US13321581Application Date: 2010-05-21
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Publication No.: US09126178B2Publication Date: 2015-09-08
- Inventor: Yu Kita , Katsushi Miki
- Applicant: Yu Kita , Katsushi Miki
- Applicant Address: JP Osaka
- Assignee: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
- Current Assignee: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Global IP Counselors, LLP
- Priority: JP2009-138522 20090609; JP2009-197754 20090828
- International Application: PCT/JP2010/058583 WO 20100521
- International Announcement: WO2010/143512 WO 20101216
- Main IPC: B32B15/02
- IPC: B32B15/02 ; B05D1/02 ; A61K9/14 ; B01J13/20 ; B01J13/18
Abstract:
Heat-expandable microspheres having high heat resistance and high solvent resistance, a production process thereof include a shell of a thermoplastic resin and a thermally vaporizable blowing agent being encapsulated therein. The thermoplastic resin includes a copolymer produced by polymerizing a polymerizable component containing a carboxyl-group-containing monomer. The surface of the heat-expandable microspheres is treated with an organic compound containing a metal of the Groups from 3 to 12 in the Periodic Table.
Public/Granted literature
- US20120064347A1 HEAT-EXPANDABLE MICROSPHERES AND A METHOD OF MAKING HEAT-EXPANDABLE MICROSPHERES AND APPLICATION THEREOF Public/Granted day:2012-03-15
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