Invention Grant
- Patent Title: Press die
- Patent Title (中): 压死
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Application No.: US14200927Application Date: 2014-03-07
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Publication No.: US09126364B2Publication Date: 2015-09-08
- Inventor: Jun Cheol Ki
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-Si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si
- Agency: Staas & Halsey LLP
- Priority: KR10-2013-0024925 20130308
- Main IPC: B29C43/04
- IPC: B29C43/04 ; B29C67/00 ; B21D5/04 ; B21D19/08

Abstract:
A press die is provided which includes a lower die having a lower core and an upper die having an upper core, the upper die includes moving blocks installed movably in a first horizontal direction and a bending shaft installed to the moving blocks, and the bending shaft presses a plate against a side surface forming portion of the lower core as the moving blocks move in the first horizontal direction, thereby enabling the plate to be deformed in the first direction.
Public/Granted literature
- US20140255532A1 PRESS DIE Public/Granted day:2014-09-11
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