A bonding apparatus configured to bond a component on a substrate is presented. The apparatus includes a stage, a push member, a support member and a compression member. The stage fixes the substrate in place and by using at least one first suction part formed in the stage. The push member is disposed above the stage and pushes the substrate fixed to the stage to support the substrate on the stage. At least one second suction part is formed in the support member to attach to a pad part of the substrate. The compression member compresses the component into the pad part fixed to the support member.