Invention Grant
- Patent Title: Wireless module with plural in-plane terminals
- Patent Title (中): 具有多个平面内终端的无线模块
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Application No.: US13927736Application Date: 2013-06-26
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Publication No.: US09129941B2Publication Date: 2015-09-08
- Inventor: Tomohiro Ikuta , Yusaku Kawabata
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2012-144093 20120627
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/31 ; H01Q1/22 ; H04B1/40
Abstract:
The wireless module according to the present invention includes a wireless IC chip for processing transmission/reception signals, a substrate on which the wireless IC chip is mounted, an antenna provided on the substrate, and a plurality of terminals extending off from the substrate in an in-plane direction of the substrate.
Public/Granted literature
- US20140001610A1 WIRELESS MODULE Public/Granted day:2014-01-02
Information query
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