发明授权
- 专利标题： Bonding pad arrangment design for multi-die semiconductor package structure
- 专利标题（中）： 多芯片半导体封装结构的焊盘排列设计
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申请号： US14271792申请日： 2014-05-07
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公开(公告)号： US09129962B1公开(公告)日： 2015-09-08
- 发明人: Hsing-Chih Liu , Chia-Hao Yang , Ying-Chih Chen
- 申请人： MediaTek Inc.
- 申请人地址： TW Hsin-Chu
- 专利权人： MEDIATEK INC.
- 当前专利权人： MEDIATEK INC.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： McClure, Qualey & Rodack, LLP
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/522 ; H01L23/538 ; H01L23/528 ; H01L23/50 ; H01L23/495
摘要：
The invention provides a semiconductor package structure. The semiconductor package structure includes a base. A first die is mounted on the base. The first die comprises a plurality of first pads with a first pad area arranged in a first tier. A plurality of second pads with a second pad area is arranged in a second tier. A second die is mounted on the base. The second die comprises a plurality of third pads with the first pad area and a plurality of fourth pads with the second pad area alternately arranged in a third tier. A first bonding wire has two terminals respectively coupled to one of the first pads and one of the fourth pads. A second bonding wire has two terminals respectively coupled to one of the third pads and one of the second pads.
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