发明授权
- 专利标题： Circuit probing structures and methods for probing the same
- 专利标题（中）： 电路探测结构和探测方法
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申请号： US13313907申请日： 2011-12-07
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公开(公告)号： US09129973B2公开(公告)日： 2015-09-08
- 发明人: Mill-Jer Wang , Ching-Nen Peng , Hung-Chih Lin , Hao Chen
- 申请人： Mill-Jer Wang , Ching-Nen Peng , Hung-Chih Lin , Hao Chen
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; H01L23/544 ; H01L23/58 ; H01L23/00
摘要：
A package component includes a stack-probe unit, which includes a first-type connector, and a second-type connector connected to the first-type connector. The first-type connector and the second-type connector are exposed through a surface of the package component.
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