Invention Grant
- Patent Title: Microstructure, micromachine, and manufacturing method of microstructure and micromachine
- Patent Title (中): 微结构,微机械,微机械和微机械的制造方法
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Application No.: US14289748Application Date: 2014-05-29
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Publication No.: US09130012B2Publication Date: 2015-09-08
- Inventor: Mayumi Yamaguchi , Konami Izumi
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2006-138835 20060518
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/762 ; B81C3/00 ; B32B38/10

Abstract:
Without sacrificial layer etching, a microstructure and a micromachine are manufactured. A separation layer 102 is formed over a substrate 101, and a layer 103 to be a movable electrode is formed over the separation layer 102. At an interface of the separation layer 102, the layer 103 to be a movable electrode is separated from the substrate. A layer 106 to be a fixed electrode is formed over another substrate 105. The layer 103 to be a movable electrode is fixed to the substrate 105 with the spacer layer 103 which is partially provided interposed therebetween, so that the layer 103 to be a movable electrode and a layer 106 to be a fixed electrode face each other.
Public/Granted literature
- US20140262000A1 Microstructure, Micromachine, And Manufacturing Method Of Microstructure And Micromachine Public/Granted day:2014-09-18
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