Invention Grant
- Patent Title: FinFET semiconductor device and method of manufacturing the same
- Patent Title (中): FinFET半导体器件及其制造方法
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Application No.: US14248594Application Date: 2014-04-09
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Publication No.: US09130040B2Publication Date: 2015-09-08
- Inventor: JaeHoo Park , Daewon Ha , Uihui Kwon , Sung-Dae Suk
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2013-0053210 20130510
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L27/092

Abstract:
Provided are a semiconductor device and a method of manufacturing the same. The method of manufacturing a semiconductor device includes forming an active fin on a substrate; oxidizing a portion of the active fin to form an insulating pattern between the active fin and the substrate; forming a first gate pattern on the substrate, wherein the first gate pattern crosses the active fin; exposing the substrate on both sides of the first gate pattern; and forming source/drain regions on the exposed substrate.
Public/Granted literature
- US20140332863A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2014-11-13
Information query
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