Invention Grant
US09130164B2 Resistive random access memory devices, and related semiconductor device structures
有权
电阻式随机存取存储器件及相关的半导体器件结构
- Patent Title: Resistive random access memory devices, and related semiconductor device structures
- Patent Title (中): 电阻式随机存取存储器件及相关的半导体器件结构
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Application No.: US14168592Application Date: 2014-01-30
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Publication No.: US09130164B2Publication Date: 2015-09-08
- Inventor: Timothy A. Quick
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L45/00 ; H01L27/24 ; H01L21/336 ; H01L21/00 ; H01L21/425 ; H01L31/032

Abstract:
A method of forming a chalcogenide material on a surface of a substrate comprising exposing a surface of a substrate to ionized gas clusters from a source gas, the ionized gas clusters comprising at least one chalcogen and at least one electropositive element. A method of forming a resistive random access memory device is also disclosed. The method comprises forming a plurality of memory cells wherein each cell of the plurality of memory cells is formed by forming a metal on a first electrode, forming a chalcogenide material on the metal by a gas cluster ion beam process, and forming a second electrode on the chalcogenide material. A method of forming another resistive random access memory device and a random access memory device including the chalcogenide material are also disclosed.
Public/Granted literature
- US20140145138A1 RESISTIVE RANDOM ACCESS MEMORY DEVICES, AND RELATED SEMICONDUCTOR DEVICE STRUCTURES Public/Granted day:2014-05-29
Information query
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