Invention Grant
- Patent Title: Electrical connector with improved contact structure
- Patent Title (中): 电连接器具有改进的接触结构
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Application No.: US14021635Application Date: 2013-09-09
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Publication No.: US09130293B2Publication Date: 2015-09-08
- Inventor: Wang-I Yu , Ya-Juan Gou , Chih-Che Chen
- Applicant: ALLTOP ELECTRONICS (SUZHOU), LTD.
- Applicant Address: CN Taicang
- Assignee: ALLTOP ELECTRONICS (SUZHOU) LTD.
- Current Assignee: ALLTOP ELECTRONICS (SUZHOU) LTD.
- Current Assignee Address: CN Taicang
- Agency: Sughrue Mion, PLLC
- Priority: CN201310355549 20130625
- Main IPC: H01R13/10
- IPC: H01R13/10 ; H01R13/41 ; H01R12/72

Abstract:
An electrical connector includes an insulative housing and a number of conductive contacts received in the insulative housing. Each conductive contact is substantially located in a main surface and includes a contacting portion extending beyond the front wall of the insulative housing, an intermediate portion extending rearward from the contacting portion and received in the insulative housing, and a termination portion bending vertically from the intermediate portion. The intermediate portion is torn to form at least an interfering means which extending away from the main surface to interferentially engage with the insulative housing for retaining the conductive contact in the insulative housing reliably.
Public/Granted literature
- US20140377967A1 ELECTRICAL CONNECTOR WITH IMPROVED CONTACT STRUCTURE Public/Granted day:2014-12-25
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