A smart phone device is fitted with a dual mode communications interface device having a housing wherein the housing provides access via an exterior of the smart phone device to both an infrared communications pathway and an electrical communications pathway each of which are coupled to one or more processing devices carried within the smart phone device. To this end, the communications interface device may be in the form of an audio jack having a plug receiving opening wherein the plug receiving opening is in communication with the electrical communications pathway and wherein at least a portion of the housing surrounding the plug receiving opening forms a light pipe for the infrared communications pathway.