The Electronic Module has a body case 2, including a plurality of case members 3, 4 and that has an internal space (S) where a first opening P1 is formed on one side surface of the internal space and a second opening P2 that opens in a direction different from that of the first opening P1 is in an exposed state when a plurality of the case members are separated each other, a substrate 5 on which a sensor IC 51 is mounted and that is housed in the internal space of the body case, and a resin body 6 that covers the substrate 5 by being filled in the internal space of the body case and solidified or hardened, and is characterized by that a plurality of the case members and the substrate 5 are integrated by the use of the resin body 6 as an accouplement.