发明授权
US09133308B2 Resin composition, and printed wiring board, laminated sheet, and prepreg using same
有权
树脂组合物，印刷线路板，层压片和使用其的预浸料
- 专利标题： Resin composition, and printed wiring board, laminated sheet, and prepreg using same
- 专利标题（中）： 树脂组合物，印刷线路板，层压片和使用其的预浸料
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申请号： US13980393申请日： 2012-01-17
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公开(公告)号： US09133308B2公开(公告)日： 2015-09-15
- 发明人: Shunsuke Nagai , Masato Miyatake , Tomohiko Kotake , Shintaro Hashimoto , Yasuo Inoue , Shin Takanezawa , Hikari Murai
- 申请人： Shunsuke Nagai , Masato Miyatake , Tomohiko Kotake , Shintaro Hashimoto , Yasuo Inoue , Shin Takanezawa , Hikari Murai
- 申请人地址： JP Tokyo
- 专利权人： HITACHI CHEMICAL COMPANY, LTD.
- 当前专利权人： HITACHI CHEMICAL COMPANY, LTD.
- 当前专利权人地址： JP Tokyo
- 代理机构： Fitch, Even, Tabin & Flannery, LLP
- 优先权： JP2011-008309 20110118
- 国际申请： PCT/JP2012/050878 WO 20120117
- 国际公布： WO2012/099134 WO 20120726
- 主分类号： C08G77/26
- IPC分类号： C08G77/26 ; C08G77/14 ; C08J5/24 ; C08L79/08 ; H05K1/03 ; C08L83/06 ; C08K5/13 ; C08K5/18 ; C08K5/3415 ; C08K5/3445 ; C08G73/06 ; C08G77/388
摘要：
There are provided a resin composition including: (a) a maleimide compound with at least two N-substituted maleimide groups per molecular structure; and (b) a silicone compound with at least one amino group per molecular structure and also provided a prepreg, a laminated plate, and a printed wiring board that are formed by using this resin composition. The multi-layered printed wiring board produced by using the laminated plate produced by laminating and molding the prepreg obtained from the resin composition of the present invention has excellent glass transition temperature, coefficient of thermal expansion, solder heat resistance, and warp characteristics. The multi-layered printed wiring board is useful as a highly integrated printed wiring board for an electronic device.