A glue-thermal curing equipment includes a chassis, a support, a heating baking plate and a lifting device. The chassis is formed with an accommodation space therein. The support is fixedly disposed in the accommodation space. The heating baking plate is disposed on the support, and has a top surface acting as a heat generating surface. The heat generating surface allows a panel device to be directly disposed thereon, and fully provides uniform thermal energy to a liquid-state glue layer disposed on the panel device. The lifting device is elevatably disposed on the support and enables the panel device to be lifted and separated from the heat generating surface.