Invention Grant
US09135944B2 Systems and methods for ejecting removable modules from electronic devices
有权
从电子设备弹出可拆卸模块的系统和方法
- Patent Title: Systems and methods for ejecting removable modules from electronic devices
- Patent Title (中): 从电子设备弹出可拆卸模块的系统和方法
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Application No.: US14089704Application Date: 2013-11-25
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Publication No.: US09135944B2Publication Date: 2015-09-15
- Inventor: Kenneth A. Jenks
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Brownstein Hyatt Farber Schreck, LLP
- Main IPC: H01R13/62
- IPC: H01R13/62 ; G11B17/00 ; H01R13/629 ; G06K13/08

Abstract:
An electronic device may be provided with an ejector mechanism for at least partially ejecting a removable module (e.g., a SIM card tray) from the device. The ejector mechanism may include a user interface portion and a tray interface portion, and each interface portion may include a first end fixed to the device and a second end coupled to the second end of the other interface portion. Tension between the fixed first ends may bias the ejector mechanism to alternate between two ejector mechanism states when the ejector mechanism receives either a user input force to eject the removable module from the connector or a tray input force to insert the removable module into the connector.
Public/Granted literature
- US20140078682A1 SYSTEMS AND METHODS FOR EJECTING REMOVABLE MODULES FROM ELECTRONIC DEVICES Public/Granted day:2014-03-20
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