Invention Grant
- Patent Title: Laminated ceramic electronic component and manufacturing method therefor
- Patent Title (中): 层压陶瓷电子元件及其制造方法
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Application No.: US13858989Application Date: 2013-04-09
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Publication No.: US09136058B2Publication Date: 2015-09-15
- Inventor: Hiroyuki Wada , Yosuke Hirata , Takashi Hiramatsu , Yoshito Saito , Hideaki Tsuji , Hiroyuki Ukai
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Agency: Arent Fox LLP
- Priority: JP2010-260792 20101124
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/005 ; H01G4/12

Abstract:
A laminated ceramic capacitor including a laminated body having a plurality of stacked ceramic layers and internal electrodes located between the ceramic layers. The internal electrodes have a plurality of ceramic columnar members formed therein, which project into the internal electrodes from interfaces between the ceramic layers and the internal electrodes, but do not penetrate in the thickness direction of the internal electrodes.
Public/Granted literature
- US20130222973A1 Laminated Ceramic Electronic Component and Manufacturing Method Therefor Public/Granted day:2013-08-29
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