Invention Grant
- Patent Title: Semiconductor integrated circuit device
- Patent Title (中): 半导体集成电路器件
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Application No.: US13846584Application Date: 2013-03-18
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Publication No.: US09136145B2Publication Date: 2015-09-15
- Inventor: Hirofumi Harada
- Applicant: Seiko Instruments Inc.
- Applicant Address: JP
- Assignee: SEIKO INSTRUMENTS INC.
- Current Assignee: SEIKO INSTRUMENTS INC.
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2012-068014 20120323
- Main IPC: H01L21/58
- IPC: H01L21/58 ; H01L23/00 ; H01L23/495
Abstract:
Provided is a semiconductor integrated circuit device having flexible pin arrangement. A semiconductor integrated circuit is bonded to a die pad with an insulating paste, and the potential of the die pad is fixed through a bonding wire from an Al pad provided on the surface of the semiconductor integrated circuit. In the case of a P-type semiconductor substrate, the die pad is set as a terminal other than a terminal having a minimum operating potential of the semiconductor integrated circuit.
Public/Granted literature
- US20130249119A1 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE Public/Granted day:2013-09-26
Information query
IPC分类:
