发明授权
- 专利标题： Enhanced package thermal management using external and internal capacitive thermal material
- 专利标题（中）： 使用外部和内部电容热材料的增强型封装热管理
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申请号： US13448711申请日： 2012-04-17
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公开(公告)号： US09136202B2公开(公告)日： 2015-09-15
- 发明人: Victor A. Chiriac , Durodami J. Lisk , Ratibor Radojcic
- 申请人： Victor A. Chiriac , Durodami J. Lisk , Ratibor Radojcic
- 申请人地址： US CA San Diego
- 专利权人： QUALCOMM Incorporated
- 当前专利权人： QUALCOMM Incorporated
- 当前专利权人地址： US CA San Diego
- 代理商 Michelle S. Gallardo
- 主分类号： H01L23/28
- IPC分类号： H01L23/28 ; H01L23/427 ; H01L23/433
摘要：
An apparatus has external and/or internal capacitive thermal material for enhanced thermal package management. The apparatus includes an integrated circuit (IC) package having a heat generating device. The apparatus also includes a heat spreader having a first side that is attached to the IC package. The apparatus also includes capacitive thermal material reservoirs contacting the first side of the heat spreader. The capacitive thermal material reservoirs may be disposed laterally relative to the heat generating device.