Invention Grant
- Patent Title: IC package with integrated waveguide launcher
- Patent Title (中): IC封装，集成波导发射器
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Application No.: US13852411Application Date: 2013-03-28
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Publication No.: US09136230B2Publication Date: 2015-09-15
- Inventor: Sergei Demin , Shaul Klein , Igal Yehuda Kushnir
- Applicant: Broadcom Corporation
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/66 ; H01P3/00 ; H01P5/107 ; H05K1/02
Abstract:
Embodiments described herein include an integrated circuit (IC) device. For example, the IC device can include a substrate configured to be coupled to a printed circuit board (PCB), an IC die attached to the substrate, and a waveguide launcher formed on the substrate. The waveguide launcher is electrically coupled to the IC die through the substrate.
Public/Granted literature
- US20140291835A1 IC Package with Integrated Waveguide Launcher Public/Granted day:2014-10-02
Information query
IPC分类:
