发明授权
- 专利标题： Methods and apparatus for sensor module
- 专利标题（中）： 传感器模块的方法和装置
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申请号： US13606289申请日： 2012-09-07
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公开(公告)号： US09136293B2公开(公告)日： 2015-09-15
- 发明人: Kuo-Chung Yee , Chun Hui Yu
- 申请人： Kuo-Chung Yee , Chun Hui Yu
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L27/146
- IPC分类号： H01L27/146 ; H01L23/48
摘要：
Methods and apparatus for integrating a CMOS image sensor and an image signal processor (ISP) together using an interposer to form a system in package device module are disclosed. The device module may comprise an interposer with a substrate. An interposer contact is formed within the substrate. A sensor device may be bonded to a surface of the interposer, wherein a sensor contact is bonded to a first end of the interposer contact. An ISP may be connected to the interposer, by bonding an ISP contact in the ISP to a second end of the interposer contact. An underfill layer may fill a gap between the interposer and the ISP. A printed circuit board (PCB) may further be connected to the interposer by way of a solder ball connected to another interposer contact. A thermal interface material may be in contact with the ISP and the PCB.
公开/授权文献
- US20140070348A1 Methods and Apparatus for Sensor Module 公开/授权日：2014-03-13
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