Invention Grant
- Patent Title: Electronic device assemblies
- Patent Title (中): 电子设备组件
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Application No.: US14258414Application Date: 2014-04-22
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Publication No.: US09137891B2Publication Date: 2015-09-15
- Inventor: Kevin D. Gibbs , Carl R. Peterson , Erik A. Uttermann , Conor P. Lenahan , John P. Ternus , Justin R. Wodrich , Elvis M. Kibiti , Derek Wright
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Treyz Law Group
- Agent G. Victor Treyz; Kendall P. Woodruff
- Main IPC: G03B17/02
- IPC: G03B17/02 ; H05K1/02 ; H01Q9/42 ; G06F1/16 ; G03B1/00 ; H05K5/02 ; H04N5/225 ; G03B19/04 ; H04M1/02 ; G03B17/22 ; G03B17/30

Abstract:
An electronic device may have a conductive housing. A dielectric structure may be mounted in the conductive housing to form an antenna window. An electrical component such as a camera, light sensor, or other device may press against a conductive foam structure. A printed circuit may have conductive traces that form an antenna ground and antenna resonating element. The printed circuit may be wrapped around a support structure. The electrical component, the conductive foam structure, and the printed circuit wrapped around the support structure may be compressed between a display cover layer and the antenna window. A camera window may be attached to a camera window trim using multiple adhesives. The trim may have a curved exterior surface that matches a curved housing surface. A flexible printed circuit cable may have a folded portion. A band structure may surround the folded portion to form a service loop.
Public/Granted literature
- US20140226291A1 Electronic Device Assemblies Public/Granted day:2014-08-14
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