发明授权
- 专利标题: Polishing apparatus
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申请号: US12379983申请日: 2009-03-05
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公开(公告)号: US09138854B2公开(公告)日: 2015-09-22
- 发明人: Kazuaki Maeda , Tamami Takahashi , Masaya Seki , Hiroaki Kusa
- 申请人: Kazuaki Maeda , Tamami Takahashi , Masaya Seki , Hiroaki Kusa
- 申请人地址: JP Tokyo
- 专利权人: EBARA CORPORATION
- 当前专利权人: EBARA CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Wenderoth, Lind & Ponack, L.L.P.
- 优先权: JP2008-055946 20080306
- 主分类号: B24B9/02
- IPC分类号: B24B9/02 ; B24B21/00 ; B24B21/06 ; B24B21/08 ; B24B37/04
摘要:
A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.
公开/授权文献
- US20090227189A1 Polishing apparatus 公开/授权日:2009-09-10