Invention Grant
- Patent Title: Electronic component and mounting structure for the electronic component
- Patent Title (中): 电子元件的电子部件和安装结构
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Application No.: US14549824Application Date: 2014-11-21
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Publication No.: US09142351B2Publication Date: 2015-09-22
- Inventor: Takanobu Katsuyama , Yasunari Nakamura , Naoto Muranishi , Masaaki Taniguchi , Takashi Sawada
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2014-016446 20140131
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H01G2/06 ; H01G4/12 ; H01G4/012 ; H01G4/248 ; H05K1/11 ; H05K1/18 ; H01G4/30
Abstract:
A first terminal electrode extends from a second principal surface onto first and second side surfaces and a first end surface such as not to reach a first principal surface. A second terminal electrode extends from the second principal surface onto the first and second side surfaces and a second end surface such as not to reach the first principal surface. A third terminal electrode extends from the second principal surface onto the first and second side surfaces such as not to reach the first principal surface.
Public/Granted literature
- US20150221436A1 ELECTRONIC COMPONENT AND MOUNTING STRUCTURE FOR THE ELECTRONIC COMPONENT Public/Granted day:2015-08-06
Information query
