Invention Grant
- Patent Title: Stacked type power device module
- Patent Title (中): 堆叠型电源设备模块
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Application No.: US13849553Application Date: 2013-03-25
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Publication No.: US09142473B2Publication Date: 2015-09-22
- Inventor: Yin-Po Hung , Tao-Chih Chang
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW101146419A 20121210
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/538 ; H01L23/29 ; H01L23/495 ; H01L21/56 ; H01L23/00 ; H01L23/367 ; H01L23/498
Abstract:
The disclosure relates to a stacked type power device module. May use the vertical conductive layer for coupling the stacked devices, the electrical transmission path may be shortened. Hence, current crowding or contact damages by employing the conductive vias or wire bonding may be alleviated.
Public/Granted literature
- US20140159212A1 STACKED TYPE POWER DEVICE MODULE Public/Granted day:2014-06-12
Information query
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