Invention Grant
- Patent Title: Semiconductor devices having stacked solder bumps with intervening metal layers to provide electrical interconnections
- Patent Title (中): 半导体器件具有堆叠的具有中间金属层的焊料凸块以提供电互连
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Application No.: US13917000Application Date: 2013-06-13
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Publication No.: US09142498B2Publication Date: 2015-09-22
- Inventor: Boin Noh , Yonghwan Kwon , Sun-Hee Park
- Applicant: Boin Noh , Yonghwan Kwon , Sun-Hee Park
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Priority: KR10-2012-0084076 20120731
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/00 ; H01L23/31 ; H01L21/56
Abstract:
An electrical interconnection can be provided using a bump stack including at least two solder bumps which are stacked on one another and at least one intermediate layer interposed between the at least stacked two solder bumps.
Public/Granted literature
- US20140035131A1 SEMICONDUCTOR DEVICES HAVING MULTI-BUMP ELECTRICAL INTERCONNECTIONS AND METHODS FOR FABRICATING THE SAME Public/Granted day:2014-02-06
Information query
IPC分类:
