Invention Grant
US09142558B2 Semiconductor device having supporter and method of forming the same
有权
具有支撑体的半导体装置及其形成方法
- Patent Title: Semiconductor device having supporter and method of forming the same
- Patent Title (中): 具有支撑体的半导体装置及其形成方法
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Application No.: US14066000Application Date: 2013-10-29
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Publication No.: US09142558B2Publication Date: 2015-09-22
- Inventor: Hyun-Jeong Yang , Soon-Wook Jung , Bong-Jin Kuh , Wan-Don Kim , Byung-Hong Chung , Yong-Suk Tak
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2012-0132422 20121121
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L49/02

Abstract:
A semiconductor device includes a plurality of lower electrodes having a vertical length greater than a horizontal width on a substrate, a supporter disposed between the lower electrodes, an upper electrode disposed on the lower electrodes, and a capacitor dielectric layer disposed between the lower electrodes and the upper electrode. The supporter includes a first element, a second element, and oxygen, an oxide of the second element has a higher band gap energy than an oxide of the first element, and the content of the second element in the supporter is from about 10 at % to 90 at %.
Public/Granted literature
- US20140138794A1 SEMICONDUCTOR DEVICE HAVING SUPPORTER AND METHOD OF FORMING THE SAME Public/Granted day:2014-05-22
Information query
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