Invention Grant
- Patent Title: Backside illumination image sensor chips and methods for forming the same
- Patent Title (中): 背面照明图像传感器芯片及其形成方法
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Application No.: US14525491Application Date: 2014-10-28
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Publication No.: US09142588B2Publication Date: 2015-09-22
- Inventor: I-I Cheng , Chih-Mu Huang , Pin Chia Su , Chi-Cherng Jeng , Volume Chien , Chih-Kang Chao
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/32
- IPC: H01L21/32 ; H01L27/146 ; H01L27/14 ; H01L21/82
Abstract:
A die includes a first plurality of edges, and a semiconductor substrate in the die. The semiconductor substrate includes a first portion including a second plurality of edges misaligned with respective ones of the first plurality of edges. The semiconductor substrate further includes a second portion extending from one of the second plurality of edges to one of the first plurality of edges of the die. The second portion includes a first end connected to the one of the second plurality of edges, and a second end having an edge aligned to the one of the first plurality of edges of the die.
Public/Granted literature
- US20150044810A1 Backside Illumination Image Sensor Chips and Methods for Forming the Same Public/Granted day:2015-02-12
Information query
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