Invention Grant
- Patent Title: Solid-state imaging device, method of manufacturing the same, and imaging apparatus
- Patent Title (中): 固态成像装置及其制造方法和成像装置
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Application No.: US14063235Application Date: 2013-10-25
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Publication No.: US09142589B2Publication Date: 2015-09-22
- Inventor: Takuji Matsumoto , Keiji Tatani , Tetsuji Yamaguchi , Masashi Nakata
- Applicant: Sony Corporation
- Applicant Address: JP
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP
- Agency: Sheridan Ross P.C.
- Priority: JP2008-289670 20081112
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
A solid-state imaging device includes a photoelectric conversion section which is disposed on a semiconductor substrate and which photoelectrically converts incident light into signal charges, a pixel transistor section which is disposed on the semiconductor substrate and which converts signal charges read out from the photoelectric conversion section into a voltage, and an element isolation region which is disposed on the semiconductor substrate and which isolates the photoelectric conversion section from an active region in which the pixel transistor section is disposed. The pixel transistor section includes a plurality of transistors. Among the plurality of transistors, in at least one transistor in which the gate width direction of its gate electrode is oriented toward the photoelectric conversion section, at least a photoelectric conversion section side portion of the gate electrode is disposed within and on the active region with a gate insulating film therebetween.
Public/Granted literature
- US20140051204A1 SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND IMAGING APPARATUS Public/Granted day:2014-02-20
Information query
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