发明授权
- 专利标题: Bonding type crystal controlled oscillator
- 专利标题(中): 键合型晶体振荡器
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申请号: US14258026申请日: 2014-04-22
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公开(公告)号: US09143114B2公开(公告)日: 2015-09-22
- 发明人: Hidenori Harima
- 申请人: NIHON DEMPA KOGYO CO., LTD.
- 申请人地址: JP Tokyo
- 专利权人: NIHON DEMPA KOGYO CO., LTD.
- 当前专利权人: NIHON DEMPA KOGYO CO., LTD.
- 当前专利权人地址: JP Tokyo
- 代理机构: Jianq Chyun IP Office
- 优先权: JP2013-091289 20130424
- 主分类号: G04F5/06
- IPC分类号: G04F5/06 ; H03B5/32 ; H03H9/10 ; H03H9/17 ; H03H9/05
摘要:
A bonding type crystal controlled oscillator includes a crystal package and a circuit package bonded by two-tier bonding. An anisotropy conductive adhesive is interposed between back surface of the crystal package facing the circuit package and an upper surface of the circuit package facing the crystal package. The anisotropy conductive adhesive includes a thermosetting resin containing solder micro particles dispersed in the thermosetting resin. Assuming that a thickness of the output terminal formed at the crystal package is C μm, a thickness of the external terminal formed at the circuit package is D μm, and an average outside diameter of the solder micro particles dispersed in the anisotropy conductive adhesive is E μm, the dimensional relation is set to (C+D)>E.
公开/授权文献
- US20140320225A1 BONDING TYPE CRYSTAL CONTROLLED OSCILLATOR 公开/授权日:2014-10-30