Invention Grant
- Patent Title: Polyamide-imide resin based insulating varnish and insulated wire covered with same
- Patent Title (中): 聚酰胺酰亚胺树脂基绝缘漆和绝缘线覆盖
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Application No.: US12870400Application Date: 2010-08-27
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Publication No.: US09145505B2Publication Date: 2015-09-29
- Inventor: Hideyuki Kikuchi , Daisuke Hino , Yuji Takano , Yasuhiro Funayama
- Applicant: Hideyuki Kikuchi , Daisuke Hino , Yuji Takano , Yasuhiro Funayama
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- Priority: JP2009-200086 20090831
- Main IPC: H01B7/02
- IPC: H01B7/02 ; C09D179/08 ; C08G73/10 ; C08G73/14 ; H01B3/30
Abstract:
There is provided an insulated wire including: a conductor wire; and a polyamide-imide insulation coating formed around the conductor wire, the polyamide-imide insulation coating being made from a polyamide-imide resin based insulating varnish, the varnish being synthesized by reaction of an isocyanate constituent and an acid constituent in a solvent, the isocyanate constituent including 5 to 50 mol % of 2,4′-diphenylmethane-diisocyanate having a flexible molecular structure.
Public/Granted literature
- US20110048766A1 POLYAMIDE-IMIDE RESIN BASED INSULATING VARNISH AND INSULATED WIRE COVERED WITH SAME Public/Granted day:2011-03-03
Information query
