Invention Grant
- Patent Title: Method of cutting target members using a cutting saw device
- Patent Title (中): 使用切割锯装置切割目标构件的方法
-
Application No.: US13920447Application Date: 2013-06-18
-
Publication No.: US09145749B1Publication Date: 2015-09-29
- Inventor: Galen R. Clark, II
- Applicant: TETRA TECHNOLOGIES, INC.
- Applicant Address: US TX The Woodlands
- Assignee: TETRA TECHNOLOGIES, INC.
- Current Assignee: TETRA TECHNOLOGIES, INC.
- Current Assignee Address: US TX The Woodlands
- Agency: Garvey, Smith, Nehrbass & North, L.L.C.
- Agent Brett A. North
- Main IPC: E03F3/06
- IPC: E03F3/06 ; E21B29/00 ; B26D1/547
Abstract:
A diamond wire saw and method provides a frame that includes a clamp that attaches to a target (e.g. piling, beam, tubular), an elongated toothed rack extending away from the mount and target, and a moving portion that carries the diamond wire and motor drives that advance the moving portion toward the target and along the toothed rack while driving the wire around roller guides.
Information query
