Invention Grant
- Patent Title: Coil parts and method of fabricating the same
- Patent Title (中): 线圈零件及其制造方法
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Application No.: US13413295Application Date: 2012-03-06
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Publication No.: US09147512B2Publication Date: 2015-09-29
- Inventor: Young Seuck Yoo , Jeong Bok Kwak , Yong Suk Kim , Sang Moon Lee , Kang Heon Hur , Sung Kwon Wi
- Applicant: Young Seuck Yoo , Jeong Bok Kwak , Yong Suk Kim , Sang Moon Lee , Kang Heon Hur , Sung Kwon Wi
- Applicant Address: KR Suwon-si, Gyeonngi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonngi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2011-0099792 20110930
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/30 ; H01F27/28 ; H01F27/24 ; H01F41/04

Abstract:
A coil part is provided. The coil part includes a coil layer including a core and a first coil and a second coil disposed on and under the core, a lower magnetic layer bonded under the coil layer, and an upper magnetic layer bonded on the coil layer. Accordingly, it is possible to improve process and productivity and cut fabrication costs by preventing process defects that occur during the fabrication process of a coil part using a ferrite substrate.
Public/Granted literature
- US20130082812A1 COIL PARTS AND METHOD OF FABRICATING THE SAME Public/Granted day:2013-04-04
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