Invention Grant
- Patent Title: Transmission module
- Patent Title (中): 传输模块
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Application No.: US14561342Application Date: 2014-12-05
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Publication No.: US09148110B2Publication Date: 2015-09-29
- Inventor: Yuki Higashide , Syunji Yoshimi , Kenji Saito
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP2012-160777 20120719
- Main IPC: H01P1/36
- IPC: H01P1/36 ; H03H7/12 ; H03H7/38 ; H03H7/52 ; H03H7/01 ; H03H7/09

Abstract:
As a capacitor Cj is connected in parallel to a non-reciprocal circuit 3, in a predetermined frequency band in which a power amplifier 2 is used, or in other words, in a predetermined frequency band used in communication, an input impedance of the non-reciprocal circuit 3 is adjusted and the length of an impedance curve (reflection coefficient S11) at an input terminal P2 of the non-reciprocal circuit 3 can thus be reduced. In addition, an output impedance of the power amplifier 2 and an input impedance of the non-reciprocal circuit 3 can be matched in a broad band through an interstage matching circuit 7 (input matching circuit 6) provided between an output terminal P1 of the power amplifier 2 and the input terminal P2 of the non-reciprocal circuit 3.
Public/Granted literature
- US20150091666A1 TRANSMISSION MODULE Public/Granted day:2015-04-02
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