Invention Grant
US09149950B2 Debris collection device for cutting mechanism and LCD panel cutting debris suction device
有权
用于切割机构的碎屑收集装置和液晶显示屏切割碎屑抽吸装置
- Patent Title: Debris collection device for cutting mechanism and LCD panel cutting debris suction device
- Patent Title (中): 用于切割机构的碎屑收集装置和液晶显示屏切割碎屑抽吸装置
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Application No.: US13376187Application Date: 2011-11-03
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Publication No.: US09149950B2Publication Date: 2015-10-06
- Inventor: Huifang Duan , Shaoyuan Zhang , Hao Jin , Rui Xu , Junjie Huang
- Applicant: Huifang Duan , Shaoyuan Zhang , Hao Jin , Rui Xu , Junjie Huang
- Applicant Address: CN Shenzhen
- Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: IPro, Inc.
- Agent Na Xu
- Priority: CN201110333473 20111028
- International Application: PCT/CN2011/081748 WO 20111103
- International Announcement: WO2013/060041 WO 20130502
- Main IPC: A47L9/02
- IPC: A47L9/02 ; B26D7/18 ; B28D7/02 ; G02F1/13

Abstract:
The present invention discloses a debris collection device for cutting mechanism and an LCD panel cutting debris suction device. A debris collection device for cutting mechanism comprises a debris collection cap and a suction spray head used for connecting with a suction device; the debris collection cap comprises a connecting part used for surrounding and fixing on the cutting mechanism, and the debris collection cap is provided with a through hole communicated with the suction spray head. The present invention can remove the debris produced in the cutting process in time, and can reduce relevant defects such as line scratches, terminal scratches, short circuit, broken circuit, etc. which are generated because of debris. Thus, the product yield and quality of LCD panels can be improved, and the time of the subsequent cleaning process can be reduced.
Public/Granted literature
- US20130104336A1 Debris Collection Device for Cutting Mechanism and LCD Panel Cutting Debris Suction Device Public/Granted day:2013-05-02
Information query