发明授权
- 专利标题: Processing apparatus
- 专利标题(中): 处理装置
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申请号: US13262005申请日: 2010-03-30
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公开(公告)号: US09150965B2公开(公告)日: 2015-10-06
- 发明人: Shuji Moriya , Toyohiko Shindo , Noboru Tamura
- 申请人: Shuji Moriya , Toyohiko Shindo , Noboru Tamura
- 申请人地址: JP Tokyo
- 专利权人: TOKYO ELECTRIC LIMITED
- 当前专利权人: TOKYO ELECTRIC LIMITED
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2009-088332 20090331
- 国际申请: PCT/JP2010/055703 WO 20100330
- 国际公布: WO2010/113946 WO 20101007
- 主分类号: C23F1/00
- IPC分类号: C23F1/00 ; H01L21/306 ; C23C16/44 ; C23C16/448 ; C23C16/452 ; C23C16/52 ; C23C16/455
摘要:
A processing apparatus includes a gas supply passage for supplying a corrosive gas having a halogen, a part of the passage being made of a metal; a stabilization reaction unit which has an energy generator for supplying light energy or heat energy to the corrosive gas that has passed through the metallic part of the gas supply passage and/or has an obstacle configured to apply a collision energy to the corrosive gas that has passed through the metallic part of the gas supply passage, the collision energy being generated from a collision between the obstacle and said corrosive gas. A reaction for stabilizing a compound containing the metal and the halogen contained in the corrosive gas takes place by means of at least one of the light energy, heat energy, and collision energy; and a trapping unit which traps the compound stabilized in the stabilization reaction unit.
公开/授权文献
- US20120055402A1 PROCESSING APPARATUS 公开/授权日:2012-03-08