发明授权
- 专利标题： Power module package
- 专利标题（中）： 电源模块封装
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申请号： US13610680申请日： 2012-09-11
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公开(公告)号： US09153514B2公开(公告)日： 2015-10-06
- 发明人: Young Ho Sohn , Young Hoon Kwak , Jong Man Kim , Kyu Hwan Oh , Tae Hyun Kim
- 申请人： Young Ho Sohn , Young Hoon Kwak , Jong Man Kim , Kyu Hwan Oh , Tae Hyun Kim
- 申请人地址： KR Gyunggi-Do
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Gyunggi-Do
- 代理机构： Ladas & Parry, LLP
- 优先权： KR10-2011-0093541 20110916
- 主分类号： H01L29/72
- IPC分类号： H01L29/72 ; H01L23/31 ; H01L23/373 ; H01L23/433 ; H01L23/495
摘要：
Disclosed herein is a power module package including: a first substrate having one surface and the other surface; a second substrate contacting one surface of the first substrate; a third substrate contacting one side of the other surface of the first substrate; a first lead frame contacting the other side of the other surface of the first substrate; and a second lead frame electrically connected to the third substrate.
公开/授权文献
- US20130069213A1 POWER MODULE PACKAGE 公开/授权日：2013-03-21
信息查询
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