A thermally controlled assembly having two parallel PCBs defining there between, and by the aid of a channel forming element, a channel in which air is forced, using a fan, to cool components in the channel. The fan has a cooling surface cooled by air from the fan and which is biased toward an element provided in a space below the cooling surface. The forced air also drawing air from outside the assembly through the space and into the channel to cool other elements provided in the space.