Invention Grant
- Patent Title: Above-ground planting bed
- Patent Title (中): 地上种植床
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Application No.: US14185738Application Date: 2014-02-20
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Publication No.: US09155252B2Publication Date: 2015-10-13
- Inventor: Barry D. Setzer
- Applicant: Barry D. Setzer
- Agency: Shefte Law PLLC
- Agent Dalbert U. Shefte
- Main IPC: A01G1/08
- IPC: A01G1/08 ; B65D35/00 ; B65D33/00 ; B65D8/14 ; A01G9/02

Abstract:
A non-cylindrical planting bed in rectangular, square or oval configuration for containing plant growth media and plants. The bed has a bottom wall, an exterior side wall, and either one or two semi-cylindrical walls inside and secured to the outer wall, or two cylindrical walls either wholly inside or having a portion forming a portion of the exterior side wall for strengthening of the bed. In forms having two cylindrical or two semi-cylindrical inner walls, cross walls may extend across the bed between straight side wall portions of the side wall to strengthen the straight side wall portions against outward displacement when the bed is filled with plant growth media.
Public/Granted literature
- US20140165464A1 ABOVE-GROUND PLANTING BED Public/Granted day:2014-06-19
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