Invention Grant
US09155671B2 Wound packing device and methods 有权
伤口包装装置及方法

Wound packing device and methods
Abstract:
Embodiments of the invention include wound packing devices and methods of making and using the same. In an embodiment, the invention includes a wound packing device including a plurality of spacing elements capable of absorbing exudate, wherein the surface of the spacing elements resist colonization by microorganisms. The wound packing device can also include a connector connecting the plurality of spacing elements to one another. Other embodiments are also included herein.
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