Invention Grant
US09157805B2 Infrared ray sensor package, infrared ray sensor module, and electronic device
有权
红外线传感器封装,红外线传感器模块和电子设备
- Patent Title: Infrared ray sensor package, infrared ray sensor module, and electronic device
- Patent Title (中): 红外线传感器封装,红外线传感器模块和电子设备
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Application No.: US13845897Application Date: 2013-03-18
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Publication No.: US09157805B2Publication Date: 2015-10-13
- Inventor: Takao Yamazaki , Seiji Kurashina
- Applicant: NEC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: NEC CORPORATION
- Current Assignee: NEC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2012-091535 20120413
- Main IPC: G01J5/04
- IPC: G01J5/04 ; G01J5/06

Abstract:
According to the present invention, the gas adsorption capability of a getter can be maintained while the characteristics of an infrared ray sensor element are prevented from being deteriorated. An infrared ray sensor package has an infrared ray sensor element, a base substrate, a housing, an infrared ray transmission window, and a getter. The infrared ray sensor element is vacuum-sealed in a space surrounded by the base substrate, the housing, and the infrared ray transmission window. A spacer is disposed between the infrared ray sensor element and the base substrate to form a gap between the infrared ray sensor element and the base substrate. The getter is arranged in the gap formed between the infrared ray sensor element and the base substrate. A heat shielding member is disposed between the infrared ray sensor element and the getter. The heat shielding member is a heater for heating the infrared ray sensor element or an element formed of alloy containing Ni or heat-resistant glass.
Public/Granted literature
- US20130306868A1 INFRARED RAY SENSOR PACKAGE, INFRARED RAY SENSOR MODULE, AND ELECTRONIC DEVICE Public/Granted day:2013-11-21
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