发明授权
- 专利标题： Radiation-sensitive resin composition and pattern-forming method
- 专利标题（中）： 辐射敏感树脂组合物和图案形成方法
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申请号： US13851158申请日： 2013-03-27
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公开(公告)号： US09158196B2公开(公告)日： 2015-10-13
- 发明人: Kazuki Kasahara , Hiromitsu Nakashima , Masafumi Hori , Masafumi Yoshida
- 申请人： JSR CORPORATION
- 申请人地址： JP Tokyo
- 专利权人： JSR CORPORATION
- 当前专利权人： JSR CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2010-220071 20100929
- 主分类号： G03F7/004
- IPC分类号： G03F7/004 ; G03F7/20 ; C08F220/20 ; H01L21/027 ; C07D307/93 ; C07D493/18 ; G03F7/039 ; G03F7/38
摘要：
A radiation-sensitive resin composition for forming a resist film includes a polymer including a first structural unit represented by a formula (1) and a second structural unit represented by a formula (2). The first structural unit and the second structural unit are included in an identical polymer molecule or different polymer molecules. R1 represents a hydrogen atom or a methyl group. Q represents a divalent linking group having 1 to 4 carbon atoms. X represents a monovalent lactone group. A part or all of hydrogen atoms included in the monovalent lactone group represented by X are not substituted or substituted. R2 represents a hydrogen atom or a methyl group. Y represents a monovalent lactone group. A part or all of hydrogen atoms included in the monovalent lactone group represented by Y are not substituted or substituted.
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