Invention Grant
- Patent Title: Touch panel and method of fabricating the same
- Patent Title (中): 触摸面板及其制造方法
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Application No.: US13974030Application Date: 2013-08-22
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Publication No.: US09158343B2Publication Date: 2015-10-13
- Inventor: Cheng-Hsing Lin , Kuo-Hua Lan , Wei-Hung Kuo , Shih-Po Chou
- Applicant: Au Optronics Corporation
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW102117797A 20130520
- Main IPC: G06F3/044
- IPC: G06F3/044 ; G06F1/16

Abstract:
A touch panel includes a substrate, a first patterned conductive layer, a patterned passivation layer, and a second patterned conductive layer. The first patterned conductive layer is located on the substrate, and the first patterned conductive layer includes a plurality of first sensing pads and a plurality of second sensing pads, wherein a gap is formed between adjacent first and second sensing pads. The patterned passivation layer is located on the first patterned conductive layer, and the patterned passivation layer covers the gap and exposes at least a portion of each first sensing pad and at least a portion of each second sensing pad. The second patterned conductive layer is located on the patterned passivation layer.
Public/Granted literature
- US20140340592A1 TOUCH PANEL AND METHOD OF FABRICATING THE SAME Public/Granted day:2014-11-20
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