Invention Grant
- Patent Title: Packaged leadless semiconductor device
- Patent Title (中): 封装无引线半导体器件
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Application No.: US14204338Application Date: 2014-03-11
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Publication No.: US09159588B2Publication Date: 2015-10-13
- Inventor: Audel A. Sanchez , Fernando A. Santos , Lakshminarayan Viswanathan
- Applicant: Audel A. Sanchez , Fernando A. Santos , Lakshminarayan Viswanathan
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/56 ; H01L23/367 ; H01L21/768 ; H01L23/495
Abstract:
A method for a packaged leadless semiconductor device including a heat sink flange to which semiconductor dies are coupled using a high temperature die attach process. The semiconductor device further includes a frame structure pre-formed with bent terminal pads. The frame structure is combined with the flange so that a lower surface of the flange and a lower section of each terminal pad are in coplanar alignment, and so that an upper section of each terminal pad overlies the flange. Interconnects interconnect the die with the upper section of the terminal pad. An encapsulant encases the frame structure, flange, die, and interconnects with the lower section of each terminal pad and the lower surface of the flange remaining exposed from the encapsulant.
Public/Granted literature
- US20150249021A1 PACKAGED LEADLESS SEMICONDUCTOR DEVICE Public/Granted day:2015-09-03
Information query
IPC分类:
