发明授权
US09159621B1 Dicing tape protection for wafer dicing using laser scribe process
有权
切割胶带保护用于使用激光划片工艺的晶片切割
- 专利标题： Dicing tape protection for wafer dicing using laser scribe process
- 专利标题（中）： 切割胶带保护用于使用激光划片工艺的晶片切割
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申请号： US14272101申请日： 2014-05-07
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公开(公告)号： US09159621B1公开(公告)日： 2015-10-13
- 发明人: Wei-Sheng Lei , Brad Eaton , Ajay Kumar
- 申请人： Wei-Sheng Lei , Brad Eaton , Ajay Kumar
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Blakely Sokoloff Taylor Zafman LLP
- 主分类号： H01L21/78
- IPC分类号： H01L21/78 ; H01L21/683
摘要：
Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of scribing a semiconductor wafer having a plurality of integrated circuits involves adhering a backside of a semiconductor wafer to an inner portion of a carrier tape of a substrate carrier that includes a tape frame mounted above the carrier tape. The method also involves overlaying a protective frame above a front side of the semiconductor wafer and above an exposed outer portion of the carrier tape, the protective frame having an opening exposing an inner region of the front side of the semiconductor wafer. The method also involves laser scribing the front side of the semiconductor wafer with the protective frame in place.
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