发明授权
- 专利标题： Semiconductor device
- 专利标题（中）： 半导体器件
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申请号： US13015445申请日： 2011-01-27
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公开(公告)号： US09159625B1公开(公告)日： 2015-10-13
- 发明人: Seung Jae Lee , Sang Won Kim , Ki Cheol Bae , Ji Heon Yu
- 申请人： Seung Jae Lee , Sang Won Kim , Ki Cheol Bae , Ji Heon Yu
- 申请人地址： US AZ Tempe
- 专利权人： Amkor Technology, Inc.
- 当前专利权人： Amkor Technology, Inc.
- 当前专利权人地址： US AZ Tempe
- 代理机构： McAndrews, Held & Malloy
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/78
摘要：
Disclosed is a semiconductor device. For instance, the semiconductor device includes a main via formed on a dielectric and a ground via formed in a circular arc shape and spaced apart from the main via. The semiconductor device is superior in electric characteristics such as insertion loss or reflection loss and allows efficient use of space.
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